GlobalFoundries to Make TSMC's SI Chip Interposers in New York in $2 Billion Deal
GlobalFoundries said on Oct. 8 it has reached a five-year, $2 billion manufacturing agreement with TSMC to produce silicon interposers at its Malta, New York facility for TSMC's CoWoS advanced packaging ecosystem. The interposer sits beneath processors and memory chips and lets them communicate at high speed, making it a small but critical piece of every advanced SI package.
GlobalFoundries said it will expand capacity at Malta to establish the first U.S.-based source of silicon interposers for advanced packaging, including versions with embedded deep trench capacitors. Volume production is expected to begin ramping in the first half of 2028, and the agreement leaves room to add more capacity if demand keeps growing.
Advanced packaging has become one of the main bottlenecks in SI chip production. Ed Kaste, the company's senior vice president of CMOS business, said building these key components in the U.S. would give customers a secure, scalable supply and strengthen the semiconductor supply chain. GlobalFoundries shares rose about 4% in premarket trading after the announcement. (GSM summary of the GlobalFoundries announcement and Reuters reporting.)
Published by GSM · USA (original Chinese edition)
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