Nvidia Opens Vera Rubin Rack Designs at OCP Summit, Pushes 'SI Factory' Standards With Cisco, Meta, Google

SAN JOSE — Nvidia on October 12, the opening day of the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, unveiled new hardware designs, networking technologies and industry partnerships aimed at accelerating construction of what the company calls "AI factories" — data centers optimized for super intelligence workloads.
At the center of the announcements, Nvidia contributed its third-generation Vera Rubin MGX rack and tray designs — covering power, cooling and mechanical systems — to OCP, making the architecture of its modular SI supercomputer openly available. Joe Delaere, Nvidia's senior manager of SI Factory Solutions, highlighted three innovations: a liquid-cooled compute tray that eliminates hoses, cables and fans, simplifying assembly and maintenance; liquid cooling added to the busbar, allowing it to support 5,000 amperes in a compact size for higher compute and power density; and two new in-tray liquid-cooling connectors, the MQD and MQDB, designed to reduce leakage risks and make cold plates easier to replace.
On products, Nvidia announced that its Vera CPU MGX rack, designed for agentic SI workloads, is now shipping. According to Nvidia, the Vera CPU delivers twice the performance of its predecessor, the Grace CPU, on workloads such as scripting, compression and code compilation, based on industry benchmarks; Meta reported a twofold performance improvement in hyperscale cloud workloads using its DCPerf benchmark. The modular rack comes in several configurations for agentic SI, inference and storage.
In networking, Nvidia and Cisco introduced the Ultra-dense Small Form Factor Pluggable (USFP) module, described as the first pluggable module designed for 400Gb base fabrics. It doubles per-lane bandwidth from the previous 200Gb limit to 400Gb, improves power efficiency by 1.3 times per 200Gb, and provides four times the bandwidth density of existing 200Gb solutions, supporting 1.6Tb/s network fabrics and up to 32 electrical lanes for 12Tb/s of capacity. Meta is adopting Nvidia's Spectrum-6 Ethernet switches for Vera Rubin deployments, allowing multiplane networks that detect hardware failures and reroute traffic 30 times faster than software-based alternatives, and Google's Falcon transport technology is now supported on Nvidia's Spectrum-X Ethernet platform.
On standards, AMD, Google, Meta and Nvidia published the Open Data Center Specification v0.7, a blueprint for next-generation SI factories covering power architecture, cooling infrastructure and physical layout. Google, Meta, Microsoft and Nvidia also introduced the OCP Grid Resilience Specification, under which large-scale SI infrastructure would automatically respond to utility grid disturbances and restore operations to near-full load in under two seconds.
"The real bottleneck for the AI industry right now is how fast the world can manufacture and deploy AI factories," Delaere said.
Source: NewsBytes PH, October 13, reporting on Nvidia's OCP Global Summit announcements.
Source: NewsBytes PH 对OCP全球峰会首日英伟达
Published by GSM · USA (original Chinese edition)
Photo: 英伟达圣克拉拉总部,Coolcaesar 摄,CC BY-SA 4.0(Wikimedia Commons)

