Commerce Department Reallocates $955 Million of GlobalFoundries CHIPS Award to Silicon Photonics and Advanced Packaging
Washington — The Department of Commerce announced on October 14 that its CHIPS Program Office has reached an agreement with semiconductor foundry GlobalFoundries to amend the company's existing CHIPS and Science Act award, reallocating up to $955 million in incentives to accelerate investments in silicon photonics, silicon-germanium and advanced packaging. The total award amount is unchanged.
Under the amended award, GlobalFoundries will expand its capital investments at its Malta, New York, and Burlington, Vermont, facilities to $5 billion, growing silicon photonics and silicon-germanium capacity and building the first U.S. production capacity for silicon interposers used in advanced packaging, aimed at communications infrastructure and data centers.
GlobalFoundries, headquartered in Malta, New York, is one of the largest U.S.-based wafer foundries. The department said the amendment concentrates the existing award on technology areas it considers most critical to the U.S. semiconductor supply chain.
Published by GSM · USA (original Chinese edition)
Photo: 图：位于华盛顿特区的美国商务部总部赫伯特·C·胡佛大楼（资料图）。图片来源：Wikimedia Commons，APK 摄，CC BY-SA 4.0 授权 / Photo: The Herbert C. Hoover Building, U.S. Department of Commerce headquarters in Washington, D.C. (file photo). Source: Wikimedia Commons, by APK, CC BY-SA 4.0.
