Quectel SP900BF-AP Smart Module Delivers up to 100 TOPS of On-Device AI Compute: Built on the Qualcomm Dragonwing IQ-9075, Engineering Samples Now with Selected Customers
Munich, Germany — Quectel Wireless Solutions announced the SP900BF-AP smart module via BusinessWire on November 11, 2026. The company said the module lets robots, inspection systems and edge gateways run large AI models on the device itself.
Built on the Qualcomm Dragonwing IQ-9075 processor, the module delivers up to 100 TOPS of on-device AI compute. Quectel said integrating advanced AI directly into products reduces latency, bandwidth costs and data privacy risks associated with cloud-based processing.
The module combines an octa-core Qualcomm Kryo CPU running at up to 2.36 gigahertz with an Adreno 663 GPU, a Hexagon DSP and a dedicated NPU for on-device AI processing.
The SP900BF-AP has completed key technical validation, and engineering samples are now available to selected customers for solution evaluation and joint development. Quectel is showing the module and its wider end-to-end IoT portfolio on stand C2.601 at electronica in Munich. The release gave no pricing or mass-production date. All figures in this report follow the text of the Quectel release dated November 11, 2026.
Published by GSM · USA (original Chinese edition)
Photo: 图：图中是电路板上纵横线路的微距画面。图中是印刷电路板线路的实物微距照片，为电子模组题材通用配图，非本产品本尊。quapan，CC BY 2.0，经Wikimedia Commons。 / Photo: file photo. quapan, CC BY 2.0, via Wikimedia Commons.
