Longsys and Lexar Showcase Edge AI Storage at Electronica 2026: A New Industrial Wide-Temperature mSSD XP2390Mi and an AISSD With a 128GB SLC Tier, Reported November 13
Storage maker Longsys and its international high-end consumer storage brand Lexar exhibited industrial, automotive and edge AI storage at electronica 2026 in Munich, Germany, from November 10 to 13, 2026. In coverage published on November 13, under the theme of integrated storage empowering edge AI, Longsys launched an industrial-grade wide-temperature mSSD and showcased automotive storage and edge AI solutions for industrial equipment, intelligent vehicles and smart devices. The new XP2390Mi industrial-grade wide-temperature mSSD targets demanding edge applications such as industrial AI inspection, edge control, outdoor devices and embodied robotics. For automotive storage, Longsys presented automotive-grade UFS, eMMC and LPDDR, as well as industrial and automotive-grade SPI NAND Flash. For edge AI devices such as AI PCs and AI boxes, the company demonstrated an AMD-platform AI host powered by its AISSD and AIDIMM products. The AISSD combines a 128GB static SLC tier for demanding AI workloads with a 512GB or 1.5TB QLC tier for models, applications and general data. The exhibits also included UFS 4.1 with iSA, adapted for Qualcomm's sixth-generation Snapdragon 8 flagship platform. Company information describes Longsys as a globally leading branded semiconductor memory enterprise.
(Source: Longsys)
Source: Longsys
Published by GSM · USA (original Chinese edition)
Photo: 图：一块固态硬盘扩展卡的产品图。Jacek Halicki，CC BY-SA 4.0，经 Wikimedia Commons。 / Photo: Jacek Halicki, CC BY-SA 4.0, via Wikimedia Commons.
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